GTK/93/02.03.01/2025 / Thin section lapping and polishing equipment and thin section/sample saw
Tiivistelmä
Katso samankaltaisia mahdollisuuksia
Kaikkien tietojen näyttäminen vaatii rekisteröitymisen ja kirjautumisen palveluun.
GTK/93/02.03.01/2025 / Thin section lapping and polishing equipment and thin section/sample saw
Hankintailmoitustyyppi
Suunnittelu [TED eF[4]]
Julkaistu
22.5.2025
11:13
(UTC+03:00)
Organisaatio
Geologian tutkimuskeskus
Kuvaus
Please note that this notice is a prior information notice/market dialogue. This notice is not a call for tenders. The purpose of the market dialogue is to engage in general discussion about the subject of the procurement and how it will be defined. The market dialogue does not obligate the contracting authority to proceed with the procurement. Likewise, participation in the market dialogue does not bind any interested supplier to take part in a potential future tendering process.
We kindly ask for your comments on the attached draft request for tenders attatched in this notice. You may provide comments directly in the documents or in any other format you prefer.
Please send your comments by June 6, 2025 at 16:00 (UTC+2) to the following email address: [email protected] with the subject line:
"GTK/93/02.03.01/2025 / Thin section lapping and polishing equipment and thin section/sample saw Tender Documents Comments".
The description of the procurement, attachments, estimated publication date of the contract notice, and other details presented in this prior information notice are preliminary and indicative.
With this request for information and market survey, we are asking suppleirs to comment on the draft tender documents and the suitability of the requirements and scoring criteria. The responses will be used solely to support the planning and preparation of the procurement.
If your documents contain trade secrets, please indicate this by including the note TRADE SECRET in the file name and at the beginning of the document.
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A bid will be requested for thin section lapping and polishing equipment and thin section/sample saw. The thin section lapping and polishing equipment must be capable of producing polished thin sections, sections with surface glass, polished sections, and glued sections made from crushed material.
The most commonly produced sections at GTK are as follows:
Polished thin section and section with surface glass, size 48 mm x 28 mm, other sizes are also possible
Polished section, size varies, normally sample is round and the size is 25 mm x 30 mm.
Glued gravel section, size varies, normally sample is round and the size is 25 mm x 30 mm.
The thickness of the polished thin section must be 0.03 mm, uniform in thickness, and the minerals must have the correct optical color for identification. The surface of the polished fine grain must be scratch-free.