THE OBJECT OF THE TENDER PROCESS

The object of the tender process is a Stylus Profilometer for both 200 mm- and 300 mm wafers. The equipment will be used in VTT's microelectronics cleanroom located in Tekniikantie 17 Espoo Finland (VTT's Micronova center for applied micro and nanotechnology). For further information, see https://www.vttresearch.com/en.

The tool must be capable of measuring 200- and 300 mm single side polished (SSP), double side polished (DSP)- and SOI silicon wafers as well as glass and fused silica wafers. 

The technical specification of the object of the tender is described in more detail in Annex 1 of this invitation to tender. The equipment must comply with all technical properties and functionalities, performance specifications and acceptance criteria as set out in Annex 1.

A tender which does not meet one or more of the requirements specified in the Annex 1, may be rejected for failing to comply with the call for tenders.

The comparison criterion for the tenders is economic advantageous (see section "Grounds for decision") with 100 % price weighting .

A reference price has to be given for the equipment that meets all the requirements set in the invitation to tender, especially its Annex 1.

The object of the tender process is described in more detail in the invitation to tender documents.

Partial tenders will not be accepted.

OPTIONS

The tenderer may offer the following non-mandatory options:

Option 1: Pattern Recognition

Option 2: Spare stylus with the following tip radiuses:

- 50 nm

- 2-3 um (standard tip)

- 50 um

Tenderer may also offer an optional 12-month extra warranty period (added to the mandatory 12 months warranty period) to equipment. VTT does not commit to purchase the extra warranty. The price(s) of the option(s) are not taken into account when comparing tenders.